2020 OCP Virtual Summit

To fulfill the needs of scaling FB infrastructure and improving performance, power, and efficiency, the development of specialized accelerators and holistic system-level solutions has shown great importance. In order to gain efficiency, thermal/mechanical design and management for those high density, small form factor modules is an important building block to ensure the overall efficiency of the solution. This talk will discuss mechanical and thermal considerations of both current and future generation of the platform for this particular use cases, provide opportunities for further efficiency gain and seek for future collaboration on standardizing and scaling the solution. The talk will also expand and share challenges of the current form factor (M.2 and dual M.2) and discuss further potential scalable form factors.

Topics that might be covered during this talk:
1. FB Glacier Point V2 architecture in YosemiteV2 platform
2. FB next generation architecture (code name TBD) in next generation platform
3. Comparison between the system generation and potential thermal efficiency and power efficiency gain
4. Challenges and Call out for Action:
Form factor impact from die size, heatsink size, orientation, new cooling technologies perspective
Potential intersection with PCIe Gen5
Package design vs. system design - how can we work together as a community