2020 OCP Virtual Summit

High Bandwidth Memory (HBM) technology has matured over the last few years, and accelerator, GPU and network device provides are shipping products in volumes with the first and the second generations of the HBM memory, using Through Silicon Via (TSV) and 3D packaging.

With the growing interest in multi-chip packaging solutions, either for die disaggregation to split to improve yield and cost; or for the heterogeneous integration by bringing different functions into the same package for improved power, cost, and bandwidth. It is worth to take a closer look at what can be learned from the challenges that were overcome by the different parts of the HBM ecosystem before it was adopted. To find what can be learned, leveraged, and considered, as the ODSA sub-group works on the die-to-die solution specifications.

The panel will bring together experts with different backgrounds and experiences in HBM system design, packaging, test, tools, and end products to share their learnings, in order to address the die-to-die ecosystem needs for broader application and market needs.