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Tuesday, May 12 • 3:00pm - 3:30pm
Advanced Cooling Solutions for OAI

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Open Accelerator Infrastructure (OAI) is a platform built around the Open Accelerator Module (OAM). Last year, we contributed the OAM specification with a reference air-cooled heatsink that could support up to 450W. The module is rated up to 700W at 48V and advanced cooling solutions become necessary for even higher power OAM products. The OAI group is working together to explore different cooling approaches, developing standard cooling solutions for OAM and OAM-based platforms. A universal baseboard (UBB) specification is already available, and we are building upon this with a common tray specification as well. In this talk, we will share the module level and system level liquid cooling solutions we have studied, and the efforts on a universal cold plate design and chassis-level standardization.


Tianyi Gao

Engineer, Baidu

Cheng Chen

Engineer, Facebook
avatar for Ethan Cruz

Ethan Cruz

Thermal Engineer, AMD

Tuesday May 12, 2020 3:00pm - 3:30pm
EW: Open Accelerator Infrastructure