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Thursday, May 14 • 9:45am - 10:00am
OCP NIC 3.0 Manageability Features Overview

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OCP NIC 3.0 specification has enabled a wide spectrum of next generation NIC board designs. One of the key aspects of OCP NIC 3.0 specification is standards-based manageability. In this talk, we will provide an overview of OCP NIC 3.0 manageability features that are based on a number of DMTF standards including NC-SI, MCTP, and PLDM. We will cover areas including sideband management interfaces, MAC address provisioning, temperature reporting, power consumption reporting, NC-SI package addressing/hardware arbitration, firmware inventory, firmware update, and FRU content.

Speakers
avatar for Hemal Shah

Hemal Shah

Distinguished Engineer, Broadcom
Hemal Shah is a Distinguished Engineer and Systems/Software/Standards architect in the Compute and Connectivity (CCX) division at Broadcom Inc. He leads a team of architects. In his role, he is responsible for the product architecture definition of Ethernet NIC products, NIC integration... Read More →
avatar for Patrick Caporale

Patrick Caporale

Distinguished Engineer, Lenovo


Thursday May 14, 2020 9:45am - 10:00am
EW: NIC 3.0 Interface/HPC