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Tuesday, May 12 • 1:30pm - 2:00pm
Air-Assisted Liquid Cooled Olympus Rack/Server Using A-L RDHX

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Direct Contact Liquid Cooling provides a solution to higher chip and rack density needs. However, many of today’s data centers are built based on aircooled designs such as free cooled-adiabatic architecture. As an intermediate step for higher chip power enablement, OCP ACS group suggested the use of A-L heat exchangers. This enables higher rack density, overall reduced power use and peak performance potential without the need to retrofit facility. This session will discuss the use of rear door heat exchangers as a cold plate enabler for the Olympus server and rack.
Speakers
avatar for Brandon Rubenstein

Brandon Rubenstein

Principal Platform Engineer, Microsoft
I've had the privilege to contribute to Microsoft's success as an engineering director, a design architect and a lead designer. Most recently I've managed the mechanical and power teams responsible for defining, designing, and maintaining Microsoft's cloud business hardware and datacenter... Read More →
avatar for Husam Alissa

Husam Alissa

Principal HW Engineer, Microsoft
Husam is a technical lead working for Microsoft Data Center Advanced Development Team with focus on next generation technologies for hardware and infrastructure.
avatar for Robert Lankston

Robert Lankston

Sr. HW Engineer, Microsoft
Robert is a Sr. Mechanical Engineer in Microsoft's Cloud Hardware Engineering team with a focus on thermal design of servers. At Microsoft, Robert contributed to the thermal design and architecture of the Olympus infrastructure as well as many of the server platforms that integrate... Read More →

Tuesday May 12, 2020 1:30pm - 2:00pm PDT
EW: Advanced Cooling Solutions
  EW: Advanced Cooling Solutions