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Wednesday, May 13 • 12:00pm - 12:30pm
Eco-System Enabling of Liquid Cooling Ingredients

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The continued demand for increased compute performance comes with an increase in server power and power density. The increased server power requires more efficient cooling capabilities compared to traditionally used air cooling. Direct liquid cooling using cold plates can provide the needed cooling capability, as well as fit within a small volume to allow for greater server and compute density in the rack. Even though liquid cooling is not a new cooling strategy for IT equipment, the industry is not ready to efficiently mass deploy liquid cooling solutions. Therefore, Intel is working to enable liquid cooling ingredients with industry partners. The intent is to create more available, lower risk, and faster time to market opportunity for OEMs to deploy liquid cooling solutions. Intel’s efforts are specifically focused on manifold distributed liquid cooling at the server rack level (i.e. the technology cooling system, TCS). The TCS is the fluid loop providing the cooling liquid from the Coolant Distribution Unit (CDU) through the rack manifold to the IT equipment cold plates, and then back again to the CDU through the rack manifold. The liquid cooling ingredients in the secondary loop included in Intel’s enabling efforts are: cooling liquid, CDU, interchangeable Universal Quick Disconnects (UQD), and cold plates. Intel’s enabling efforts, together with Intel’s strategy to enable these ingredients was first introduced at the OCP Global Summit 2019, and an update on the eco-system enabling status will be presented at the OCP Global Summit 2020.

Speakers
avatar for Jessica Gullbrand

Jessica Gullbrand

Tech Lead Thermal Engineer, Intel
Jessica is a Thermal Tech Lead Engineer at Intel in the Data Platform Group (DPG). She is currently working on energy efficiency, immersion, and liquid cooling cold plate technologies. Jessica has worked on new and innovative technology solutions in fluids, acoustics, and thermals... Read More →
avatar for Mark Sprenger

Mark Sprenger

Tech Lead Engineer, Intel
Mark Sprenger is Senior Mechanical Engineer and Technical Lead in Data Platform Group responsible for external development of cooling solutions for commercial datacenter products. Mark has over 25 years of industry experience in advanced development covering a wide variety of technologies... Read More →


Wednesday May 13, 2020 12:00pm - 12:30pm
EW: Advanced Cooling Solutions