With the growing utilization of liquid cooling to address the high temperature output of electronics and computing systems, the impact of individual components on flow rate is often misunderstood or undervalued. As designers embrace the fact that liquid cooling is better at transferring heat at much lower mass flow rates compared to air cooling, attention to thermodynamics in combination with flow rate is critical -- whether the liquid cooling application is for HPC, electric vehicle charging, data centers or laser diode cooling.
This presentation will address individual component selection that affect flow rates and pressures and why variability matters. Discussion will include pumps and system pressure, air inclusion, coolant selection, QD valve design, terminations, circuit tubing diameter, potential failure scenarios and testing for risk mitigation. It will also include a deep dive into quick disconnects. You’ll learn why/how the selection of coolant is dependent upon the application and how this impacts the material selection requirements for each subsequent component in the liquid cooling system. Attendees will leave with an understanding of how to calculate the total pressure drop in the liquid line (via expansions, contractions, bends, valves), what is not often understood about quick disconnects, why pump sizing matters in fulfilling hydrodynamic requirements to address thermal requirements and what to look for in designing an optimized system.
Beth Langer is the Lead Technical Engineer in the Thermal Management Business Unit at CPC where all connectors manufactured for liquid cooling applications meet or exceed established criterion.
